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@teortaxesTex: ok what the hell. I missed this completely So, Huawei expects to deploy LogicFolding Ascends in 2030/31, and have >400 Mtr/mm^2, *and* ha...

@teortaxesTex 3 信息等级 3 1 噪音/剔除；2 较弱；3 普通事实；4 重要行业动态；5 极重大事件。该分数是信息显著性，不是投资建议。 发布：2026-06-05T10:53 抓取：2026-06-05 11:18
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摘要

华为计划在2030/31年部署LogicFolding Ascends芯片，密度超过400 Mtr/mm²，单芯片功耗达30KW，可能采用晶圆级引擎设计。

客观事实
  • 华为计划2030/31年部署LogicFolding Ascends芯片
  • 芯片密度超过400 Mtr/mm²
  • 单芯片功耗30KW，可能采用晶圆级引擎
华为

原文

ok what the hell. I missed this completely
So, Huawei expects to deploy LogicFolding Ascends in 2030/31, and have >400 Mtr/mm^2, and have single-chip power draw of 30KW. I think this must mean heavy design for yield and, likely, Cerebras-style wafer-scale engines. https://t.co/ibQIaXmO6F

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