@jukan05: According to Korean media reports, Intel is investing several billion dollars in EMIB packaging, which is said to offer better cost and prod...

@jukan05 3 信息等级 3 发布：2026-05-28T07:15 抓取：2026-05-28 11:29

🔗 原文链接

半导体行业动态

摘要

据韩媒报道，英特尔正投资数十亿美元用于EMIB封装技术。该方案据称在成本与生产效率方面优于台积电主导的硅中介层2.5D封装技术。该资讯反映了头部芯片企业在先进封装领域的资本投入与技术路线竞争情况。

客观事实

英特尔正投资数十亿美元用于EMIB封装技术
EMIB封装据称在成本与生产效率上优于台积电2.5D封装
该消息来源于韩国媒体报道

英特尔 EMIB封装台积电韩国媒体

原文

According to Korean media reports, Intel is investing several billion dollars in EMIB packaging, which is said to offer better cost and productivity than TSMC-led silicon interposer-based 2.5D packaging. https://t.co/pVvvmJQvZh

likes: 263 | retweets: 28 | replies: 6 | views: 36714