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@SEMIconex: Glass core substrates are moving into focus for next-generation advanced packaging. As AI and HPC drive demand for larger and more complex ...

@SEMIconex 3 信息等级 3 1 噪音/剔除；2 较弱；3 普通事实；4 重要行业动态；5 极重大事件。该分数是信息显著性，不是投资建议。 发布：2026-05-27T15:50 抓取：2026-05-27 17:19
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行业 半导体 AI 算力
摘要

SEMI与Global Net Corp.发布玻璃基板市场报告，指出AI和高性能计算推动先进封装需求，预测2028-2040年玻璃基板市场复合年增长率为67.2%。

客观事实
  • SEMI和Global Net Corp.发布玻璃基板市场报告
  • 预测2028-2040年CAGR为67.2%
SEMI Global Net Corp. 玻璃基板

原文

Glass core substrates are moving into focus for next-generation advanced packaging.

As AI and HPC drive demand for larger and more complex semiconductor packages, a new SEMI and Global Net Corp. report examines the market outlook, technology trends, ecosystem activity, and adoption challenges for glass core substrates.

The report projects a 67.2% CAGR from 2028 to 2040 under its market outlook.📈

Learn more: https://t.co/3ryQlYtg3p

📊 Download the report: https://t.co/77PFLs8lb6

SEMI #MarketIntelligence #Semiconductors #AdvancedPackaging #GlassCoreSubstrates #AI #HPC

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