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@zephyr_z9: Out of this, bottleneck & supply crunch can be interchangeable sometimes In CCL, we are seeing rapid innovation in copper foil and glass fib...

@zephyr_z9 3 信息等级 3 1 噪音/剔除;2 较弱;3 普通事实;4 重要行业动态;5 极重大事件。该分数是信息显著性,不是投资建议。 发布:2026-05-26T20:19 抓取:2026-05-26 23:18
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摘要

讨论覆铜板行业高端市场铜箔和玻纤创新导致瓶颈,低端市场T-glass FR4箔出现供应紧张,类似情况也发生在低端存储器领域。

客观事实
  • CCL行业高端市场铜箔和玻纤创新导致瓶颈
  • 低端市场T-glass FR4箔出现供应紧张
CCL 铜箔 玻璃纤维 T-glass FR4箔 低端存储器

原文

Out of this, bottleneck & supply crunch can be interchangeable sometimes
In CCL, we are seeing rapid innovation in copper foil and glass fiber (the high end market) and this has turned into a bottleneck
But at the lagging edge, there is a geniune supply crunch for T-glass FR4 foil
This also happened to lagging edge memory

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