讨论覆铜板行业高端市场铜箔和玻纤创新导致瓶颈,低端市场T-glass FR4箔出现供应紧张,类似情况也发生在低端存储器领域。
Out of this, bottleneck & supply crunch can be interchangeable sometimes
In CCL, we are seeing rapid innovation in copper foil and glass fiber (the high end market) and this has turned into a bottleneck
But at the lagging edge, there is a geniune supply crunch for T-glass FR4 foil
This also happened to lagging edge memory
likes: 81 | retweets: 3 | replies: 10 | views: 19887