华为SkyBridge芯片设计技术通过利用顶层金属层低电阻，折叠并连接关键数据路径，实现创新堆叠方式，不同于传统芯片堆叠。
Looks like it's quite different from that
They are not just stacking chips on top of each other
Very clever chip design from Huawei
SkyBridge basically takes advantage of the lower resistance offered by the top metal layers
They are folding & connecting the critical data paths/wiring thru it
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