华为在混合键合技术上取得突破，其“tau scaling”依赖HB触点作为电路内路由层，间距缩小到可成为时序路径的一部分，区别于普通3D堆叠。
Huawei is pushing hybrid bonding to the extreme
The success of their "tau scaling" depends on the HB contact acting as a damn good intra-circuit routing layer and not just package I/O.
This is the biggest innovation here and what separates their tech from normal 3D stacking
The vertical interconnects between the stacks generally act as the interface, but they have reduced the pitch so much that it can become a part of the timing path
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