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@zephyr_z9: 1M WPM for HBM by end of 2027 is too aggressive "We forecast front end wafer capacity allocated to HBM will grow from 390k wpm at end of 2...

@zephyr_z9 3 信息等级 3 1 噪音/剔除；2 较弱；3 普通事实；4 重要行业动态；5 极重大事件。该分数是信息显著性，不是投资建议。 发布：2026-05-23T10:11 抓取：2026-05-24 12:57
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行业 半导体 AI
摘要

分析师预测HBM晶圆产能将从2025年底的390k wpm增至2026年底的500k及2027年底的960k，认为行业预期2027年底达1M wpm过于激进。

客观事实
  • HBM晶圆产能2025年底390k wpm
  • 预测2026年底500k wpm，2027年底960k wpm
  • 分析师认为1M wpm目标过于激进
HBM

原文

1M WPM for HBM by end of 2027 is too aggressive

"We forecast front end wafer capacity allocated to HBM will grow from 390k wpm at end of 2025 to 500k/960k at the end of 2026-27, eating away at capacity for DRAM where demand is also rising for agentic/inference tasks and general servers"

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