Thermal Design Changes Lead to Slight Delay for RubinRubin has experienced a several-week delay in its overall schedule due to modifications to its thermal design. This delay stems primarily from a massive surge in chip power consumption to 1800-2300W. The original plan to implement liquid metal for superior thermal conductivity faced leakage issues, forcing the final selection of thermal interface material (TIM2) to switch to a graphite design. Additionally, Nvidia altered the lid design in early May, shifting from the original dual-piece lid to a single-piece design. This series of thermal architecture changes and recalibrations—aimed at resolving liquid-metal leakage and structural reorganization—ultimately pushed back Rubin's volume production and shipment timeline by several weeks. Consequently, we have lowered Rubin’s shipment share for 2026.
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