文章指出，最大化直接芯片液冷（D2C）潜力需要重新设计水暖基础设施，聚合物材料能够提升效率、可靠性和可扩展性，为数据中心液冷提供新思路。
Maximising the potential of D2C liquid cooling requires a new approach to hydronic design. Here, polymers enable efficiency, reliability, and scalability