塔半导体(TSEM)报告额外支付2.9亿美元预付款以保障产能。下游代工厂产能紧张,直接驱动上游原材料基板需求。
Just in case you were wondering $TSEM reported extra prepayment ($290M) to secure capacity.
Downstream foundry capacity squeeze directly translates to an immense demand for raw substrates upstream with $SOI (more revenue).
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