该推文指出,随着TPU v8、Rubin和Trainium3于2026年第四季度开始量产,PCB/互连瓶颈问题将受到更多关注。
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U will be hearing a lot more about the PCB/interconnect bottleneck when mass production of TPU v8, Rubin, and Trainium3 starts in Q4 2026
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