总结近期半导体动态:台积电推动CoPoS技术;苹果转向英特尔代工;英伟达Vera Rubin改变冷却架构;2D NAND短缺加剧;大型科技公司资助SK海力士建厂;台积电2026年4月营收126亿美元同比增30%;Anthropic与SpaceX合作获得算力;SKC加速玻璃基板量产;功率芯片短缺加深。
Just a TLDR of recent semi developments:
$TSM pushing hard CoPoS - VisEra/others might go brrr earlier than expected.
$AAPL goes with $INTC for semi production, which is a major shift cause they normally go with TSM. Made in America go like Intel go brrr.
$NVDA Vera Rubin reportedly makes changes to cooling architectures very recently.
"Taiwan's thermal management suppliers are emerging as one of the fastest-growing segments in the AI hardware ecosystem" - From Last Month.
"Vera Rubin server architecture is expected to drive a fundamental shift in data center cooling and system design"
Will cover thermal ecosystem later, maybe it's time to take a look?
Macronix, Windbond go brrr. implications for GigaDevice and other niche players.
"Big Tech reportedly offers to fund SK Hynix fabs and EUV"
Memory that badly bottlenecked that mag7 wants to pay for it, so $MU, SK Hynix, Samsung go brr.
$TSM 2026 net revenue $12.6B for April 2026. Revenue up 30%, Semis keep going brr.
Anthropic needs compute -> SpaceX.
So implications for compute demand is extreme here which is BRRR $NBIS and others.
But it's very interesting they sidestepped Neoclouds and went with SpaceX.
"the end of the year, ahead of its original plan, it has been announced"
Glass Core substrates players like $LPK for mass production and other related players like SKC go brrr.
Glass timelines moved up. heavy brrr glass.
Maybe time to look into the power chip bottleneck anon?
Another positive for $MU, SK Hynix, Samsung, $SNDK, and others.
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