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@SEMIconex: How do design and manufacturing truly collaborate in an era of high integration? We spoke with Lu Dai, Vice President of Technical Standa...

@SEMIconex 2 信息等级 2 1 噪音/剔除；2 较弱；3 普通事实；4 重要行业动态；5 极重大事件。该分数是信息显著性，不是投资建议。 发布：2026-04-21T15:08 抓取：2026-04-30 12:16
🔗 原文链接
半导体 行业 动态
摘要

高通技术标准副总裁Lu Dai接受SEMI官方采访，围绕高集成时代下芯片设计、晶圆代工、先进封装与EDA工具之间的协同合作模式展开探讨。内容指出，随着半导体架构复杂度持续提升，产业链上下游的深度技术协作已成为推动行业发展的关键方向。

客观事实
  • 高通技术标准副总裁Lu Dai接受SEMI采访。
  • 访谈聚焦芯片设计、代工、封装与EDA工具的协同。
  • 半导体架构复杂化使产业链协作成为关键。
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原文

How do design and manufacturing truly collaborate in an era of high integration?

We spoke with Lu Dai, Vice President of Technical Standards at @Qualcomm, on what collaboration really means across chip design, foundries, packaging, and EDA tools, and why it is becoming mission critical as architectures grow more complex.

Read the full blog: https://t.co/NkGdsU9J1u

Semiconductors #SEMI #ChipDesign #Manufacturing #Chiplets #EDA @ESDAlliance

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